I-Laser Direct Imaging (LDI)

I-Maskless lithography ingenziwa yi-LDI. Inezinzuzo eziningi ekuxazululeni izithombe, ukunemba kokuqondanisa, isivuno somkhiqizo, i-automation nokunye. Okuthatha indawo ngokushesha izindlela zokukhiqiza zokuchayeka imaski. Ukuphrinta kwe-3D kwezinto ezifana ne-polymer, izitsha zobumba nazo zingatholwa yi-LDI.

I-TCS ka-Han ingahlinzeka ngesistimu ye-laser ye-semiconductor engu-405nm kubakhiqizi bamadivayisi e-LDI. Ngokusekelwe kuma-chips ekhwalithi ephezulu, singaqinisekisa ukuzinza nokufana kwamandla okuchayeka, ubuchwepheshe obuphambili, ukusebenza okuhle kakhulu. Sinamakhasimende amaningi emishini ye-LDI kanye nesipiliyoni sohlelo lokusebenza lwemboni ecebile.

Njengomkhiqizi we-laser we-semiconductor ohamba phambili nomkhiqizi wesistimu e-China, i-TCS ye-Han isifinyelele izinga elihamba phambili lamazwe ngamazwe ekufakweni kwe-semiconductor laser diode kanye nobuchwepheshe bokuhlanganisa i-fiber. Sihlinzeka ngesistimu ye-laser engu-405nm ene-12W, 24W, 30W, 50W, 100W amazinga amaningi wamandla embonini ye-LDI.

Ubuchwepheshe bokuhlanganisa i-Space beam.

Okukhipha i-fiber eyodwa, amandla aphezulu kanye nokukhanya okuphezulu.

Imodi yokulawula eguquguqukayo: I-Analog /RS232.

Uhlelo olusebenzayo lokupholisa amanzi.

Ukusebenza kahle kokuguqulwa kwe-electro-optic, ukusetshenziswa kwamandla okuphansi.

Ilula futhi ihlangene, kulula ukuyinakekela.

Ngaphezulu kwamanje, phezu kwe-voltage, izinga lokushisa elingaphezulu nezinye izindlela zokuvikela eziningi.

Imojula yomthombo wokukhanya ihlanganisa imishayo yokukhanya yama-chips amaningi okukhanya ku-fiber optical ngokusebenzisa ubuchwepheshe bokuhlanganisa i-spatial beam, I-fiber core diameter ingu-400μm noma 600μm, futhi ikhwalithi ye-beam yinhle, ukukhanya kuphakeme, futhi ukuzinza kunamandla.

Uhlelo lwamukela idizayini ye-fiber optical ekhiphekayo, efakwe izintambo ezithembeke kakhulu ze-fiber patch, ukugcinwa okulula.